MPPCs incorporate through-hole electrodes

15th August 2016
Posted By : Daisy Stapley-Bunten
MPPCs incorporate through-hole electrodes

The range of Multi-Pixel Photon Counters (MPPC); the S13360-VE series has been introduced by Hamamatsu Photonics. These COB package type MPPCs incorporate through-hole electrodes called TSV (Through-Silicon Via). This process optimises the available space between the sensitive area and the package edge (0.2mm on the four sides), allowing for a four-sided buttable arrangement.

The VE series is available with photosensitive areas of 2x2mm, 3x3mm and 6x6mm, each with a 50μm pixel pitch. Features include reduced crosstalk (compared to previous MPPCs) and crosstalk occurrences have been reduced from 44 to just 3%, while after pulsing affects are minimal. In addition, the dark count has been dramatically reduced, compared to previous detectors, to 0.5Mcps.

The S13360-VE series is optimised for a variety of applications, particularly those involving very low light-level detection. Other example applications include high-energy particle detection and medical imaging.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

SPE Offshore Europe 2017
5th September 2017
United Kingdom Aberdeen Exhibition & Conference Centre
EPE 2017 ECCE Europe
11th September 2017
Poland Warsaw
ON Semiconductor Power Seminars 2017
11th September 2017
United Kingdom
DSEI 2017
12th September 2017
United Kingdom ExCeL, London
RWM 2017
12th September 2017
United Kingdom NEC, Birmingham