Plessey expands with Chip Scale Packages and Wafer Level Packaging

11th November 2014
Posted By : Jacqueline Regnier
Plessey expands with Chip Scale Packages and Wafer Level Packaging

Plessey today announced its expansion into Chip Scale Packages and Wafer Level Packaging solutions leading to its Application Specific LED -- the AS-LED.  Recent performance improvements have elevated Plessey's award winning GaN-on-Silicon technology MaGIC LEDs to be competitive with any LED technology with improvements in key critical areas including lumens/watt, elevatingGaN-on-Silicon above existing LED technology. 

Plessey's range of products for lighting applications will be showcased at LuxLive, ExCel London, 19-20 November, Stand D31. The show will open on Wednesday 19th November from 9am to 9pm and on Thursday 20th November from 9am to 5pm. The show is free to attend

There will be innovative demonstrations by technical and design experts for Plessey's LED technology at the stand. This is an opportunity to gain a deeper understanding of Plessey's latest products and solutions for the commercial, industrial, consumer and wearable lighting segments.

Plessey's MaGIC™ (Manufactured on GaN-on-Si I/C) High Brightness LED (HBLED) technology has won numerous awards for its innovation and ability to cut the cost of LED lighting by using standard silicon manufacturing techniques.


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