Events News
Bopla presents the new BoVersa electronics enclosure
Bopla is presenting the new BoVersa enclosure system at embedded world, one of the leading international fairs, at Nuremberg.
Visit maxon at SPACE-COMM EXPO
maxon, the manufacturer of DC motor and drive solutions, is exhibiting at SPACE-COMM EXPO, at the Farnborough International Exhibition and Conference Centre, 6–7 March 2024.
Anglia, ADI partner for signal conditioning workshop
Anglia is partnering with Analog Devices (ADI) to present two in-depth, technical workshops on signal conditioning.
Avnet Abacus presents stellar suppliers at embedded world
Under the theme of ‘Making Ideas Reality’, Avnet Abacus will present a diverse range of supplier partners across a variety of industries at the embedded world exhibition in Nuremberg (April 9-11).
Rohde & Schwarz lines up EMC test solutions for EMV 2024
Rohde & Schwarz will showcase a comprehensive range of EMC test and measurement solutions – ranging from standalone instruments and software to application-specific systems at the EMV 2024 show in Cologne (March 12-14).
Direct Insight showcases QNX and SoM Development
Direct Insight, the UK-based technical systems integrator and reseller of system-on-module (SoM) and other embedded systems, will attend the upcoming Medical Technology UK exhibition, which runs on the 13–14 March 2024 at the Coventry Building Society Arena.
PCIM Europe 2024
The PCIM Europe, the international conference for power electronics, is pleased to publish its comprehensive conference programme for the upcoming event.
SEMI ISS Europe 2024 to highlight European Chips Act
The European Chips Act and other critical semiconductor industry topics will come into sharp focus at SEMI Industry Strategy Symposium Europe (ISS Europe) 2024, opening in Vienna, Austria for the latest insights into sustainability, workforce development, and semiconductor supply chain resilience.
MacDermid Alpha boosts semiconductor reliability at IMAPS 2024
MacDermid Alpha Electronics Solutions, a pioneering supplier of integrated materials and chemistries to the electronics industry, is participating at the IMAPS 20th Annual Device Packaging Conference, Arizona 18–21 March 2024.
Indium to feature Durafuse solder technology
Indium Corporation features its innovative Durafuse solder technology alongside its Rel-ion portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, 9–11 April 2024, in Anaheim, California, US.