3.3A photorelay for testing and control applications

Posted By : Nat Bowers
3.3A photorelay for testing and control applications

Housed in a 6.3x7.0mm 2.54SOP6 package, the TLP3107 photorelay has been introduced by Toshiba. With a high-current of 3.3A (maximum), the photorelay is suited for factory automation, security system and testing applications, including power-line switching, feedback resistance switching and measuring-line switching.

Photorelays provide design engineers with fast switching speed, high reliability, lower power consumption and noise-free operation in a space-saving package, making them an alternative to mechanical relays. Consisting of a photo MOSFET optically coupled to an infrared light emitting diode, the photorelay utilises the latest generation trench MOSFET to realise an approximately 1.4 times higher on-state current than Toshiba’s existing product, the TLP3103.

Featuring low on-state resistance and high permissible on-state current, the TLP3107 will accelerate the replacement of mechanical relays in applications that require high density assembly. Replacing a 3A-capable DIP package with the 2.54SOP6 package reduces the assembly area by 40%, and the overall product height by half.

Other features include trigger LED current 3mA (maximum); off-state output terminal voltage 60V (minimum); and isolation voltage 1500Vrms (minimum).

Downloads


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Startups Magazine Launch Party: Financing a Startup
24th July 2018
United Kingdom WeWork Waterhouse Square, London
European Microwave Week 2018
23rd September 2018
Spain Ifema Feria De Madrid
IoT Solutions World Congress 2018
16th October 2018
Spain Barcelona
Engineering Design Show 2018
17th October 2018
United Kingdom Ricoh Arena, Coventry
Maintec 2018
6th November 2018
United Kingdom NEC, Birmingham