Toshiba Electronics announces ultra-compact IC-Coupler for high speed, extended temperature applications requiring reinforced insulation

20th August 2010
Posted By : ES Admin
Toshiba Electronics announces ultra-compact IC-Coupler for high speed, extended temperature applications requiring reinforced insulation
Toshiba Electronics Europe (TEE) has announced an ultra-compact photocoupler that delivers data transmission at speeds up to 20Mbps, features a minimum isolation voltage of 3750Vrms, and offers guaranteed operation from -40°C to 125°C.
The TLP118 integrates a GaAlAs infrared LED, optically coupled to a high-gain, high-speed photodetector, into an SO6 package measuring just 4.5mm x 3.7mm x 2.1mm. Target applications for the device will include high-speed communication interfaces in factory automation systems, office products, measurement and control equipment and digital appliances such as plasma display panels (PDPs).

Designed to meet the reinforced insulation requirements of global safety standards, the SO6 package has guaranteed minimum creepage and clearance distances of 5 mm and a minimum internal insulation thickness of 0.4 mm. The photodetector features an internal Faraday shield to provide for a high common mode transient immunity of ±15kV/µs.

The TLP118 is configured with a general-purpose inverter logic (open collector) output stage and operates from a power supply voltage of 4.5V to 5.5V.

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