Toshiba Electronics announces ultra-compact IC-Coupler for high speed, extended temperature applications requiring reinforced insulation

20th August 2010
Posted By : ES Admin
Toshiba Electronics announces ultra-compact IC-Coupler for high speed, extended temperature applications requiring reinforced insulation
Toshiba Electronics Europe (TEE) has announced an ultra-compact photocoupler that delivers data transmission at speeds up to 20Mbps, features a minimum isolation voltage of 3750Vrms, and offers guaranteed operation from -40°C to 125°C.
The TLP118 integrates a GaAlAs infrared LED, optically coupled to a high-gain, high-speed photodetector, into an SO6 package measuring just 4.5mm x 3.7mm x 2.1mm. Target applications for the device will include high-speed communication interfaces in factory automation systems, office products, measurement and control equipment and digital appliances such as plasma display panels (PDPs).

Designed to meet the reinforced insulation requirements of global safety standards, the SO6 package has guaranteed minimum creepage and clearance distances of 5 mm and a minimum internal insulation thickness of 0.4 mm. The photodetector features an internal Faraday shield to provide for a high common mode transient immunity of ±15kV/µs.

The TLP118 is configured with a general-purpose inverter logic (open collector) output stage and operates from a power supply voltage of 4.5V to 5.5V.

You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Startups Magazine Launch Party: Financing a Startup
24th July 2018
United Kingdom WeWork Waterhouse Square, London
European Microwave Week 2018
23rd September 2018
Spain Ifema Feria De Madrid
IoT Solutions World Congress 2018
16th October 2018
Spain Barcelona
Engineering Design Show 2018
17th October 2018
United Kingdom Ricoh Arena, Coventry
Maintec 2018
6th November 2018
United Kingdom NEC, Birmingham