Optoelectronics

Displaying 11 - 20 of 576

On-chip optical filter processes wide range of wavelengths

On-chip optical filter processes wide range of wavelengths
MIT researchers have designed an optical filter on a chip that can process optical signals from across an extremely wide spectrum of light at once, something never before available to integrated optics systems that process data using light. The technology may offer greater precision and flexibility for designing optical communication and sensor systems, studying photons and other particles through ultrafast techniques, and in other applications.
7th August 2018

Integrated optical module reduces smoke detector false alarms

Integrated optical module reduces smoke detector false alarms
Analog Devices has introduced the ADPD188BI, an integrated optical module featuring two LEDs, photodiode, and analog front-end (AFE) integrated together in a single package. The high performing AFE offers high ambient light rejection and reduces power consumption to support longer battery life. The two LEDs help reduce false alarms often caused by steam and dust. False alarms are a leading factor in detectors being removed or disabled by consumers.
3rd July 2018

Turning silicon photonics into a competitive asset for the electronics industry

VTT Technical Research Centre of Finland, together with Tampere University of Technology (TUT), has accelerated the development and commercialisation of silicon photonics products as part of the renewal of the Finnish electronics industry. With the help of silicon photonics, companies can develop increasingly compact, more efficient and more affordable products, where optical signals are used for such purposes as precise measuring, laser imaging and rapid data transfer.
21st June 2018


Enabling the development of electro-optical devices

Enabling the development of electro-optical devices
A research team led by physicists at the Technical University of Munich (TUM) has developed molecular nanoswitches that can be toggled between two structurally different states using an applied voltage. They can serve as the basis for a pioneering class of devices that could replace silicon-based components with organic molecules. The development of new electronic technologies drives the incessant reduction of functional component sizes.
11th June 2018

Squeezing light into nanoscale devices and circuits

Squeezing light into nanoscale devices and circuits
As electronic devices and circuits shrink into the nanoscale, the ability to transfer data on a chip, at low power with little energy loss, is becoming a critical challenge. Over the past decade, squeezing light into tiny devices and circuits has been a major goal of nanophotonics researchers. Electronic oscillations at the surface of metals, known as surface plasmon polaritons or plasmons for short, have become an intense area of focus.
24th May 2018

Photorelay is suitable for factory automation

Photorelay is suitable for factory automation
Toshiba Electronics Europe has released the TLP3122A photorelay for factory automation and other industrial applications including building automation, security and semiconductor testing. The photorelay integrates MOSFET devices fabricated using the latest U-MOS IX process to reduce on-state resistance. Housed in the small 4-pin SO6 package, the TLP3122A provides an off-state output terminal voltage (VOFF) of 60V, a constant on-state current (ION) of 1.4A and an on-state pulsed current (IONP) up to 4.2A.
22nd May 2018

Low-cost avalanche photodiode comes in an M1 package

Low-cost avalanche photodiode comes in an M1 package
LASER COMPONENTS has announced that its cost-effective SAH series of avalanche photodiodes (APDs) is now available in an M1 package. This is the smallest available SMD housing (Surface-Mounted Device), at only 2 mm x 1.4 mm. The new APDs will be presented at SPIE DCS in Orlando, Florida (Booth 1029). Optimised for wavelengths of 850 nm and 905 nm, these components are mainly designed for range finding applications in which larger detectors cannot be installed due to lack of space.
6th April 2018

Imaging technique pulls plasmon data together

Imaging technique pulls plasmon data together
Rice University scientists have developed a novel technique to view a field of plasmonic nanoparticles simultaneously to learn how their differences change their reactivity. Their new method is called snapshot hyperspectral imaging (SHI), which up to now has been used primarily in astronomy. SHI allows researchers to view minute differences between otherwise identical nanoparticles and see how they react in response to light and environmental changes.
16th March 2018

Latest line-up of high speed signal transmission photorelays

Latest line-up of high speed signal transmission photorelays
Toshiba Electronics Europe has announced the launch of two high speed signal transmission photorelays that offer the industry’s smallest footprint. The TLP3475S features low on-state output resistance (RON) – typically 1.1Ω and offers fast switching times of 0.5ms (ton) and 0.4ms (toff). The device is rated for 60V (VOFF) and a max. current of 0.4A (ION). The device is housed in an S-VSON4 package measuring just 2.00mm x 1.45mm x 1.65mm.
14th March 2018

Data centre routing ASIC with integrated optics

Rockley Photonics has announced that it is demonstrating its in-package-optics platform to select customers and development partners. Rockley has developed the world’s first single-chip L3 routing switch to directly integrate 100G network ports using single-mode fibre. Leveraging Rockley OpticsDirect technology, this platform is among the first of its kind to integrate high-speed optical interconnect with high-scale CMOS digital and mixed-signal circuits.
12th March 2018


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Southern Manufacturing & Electronics 2019
5th February 2019
United Kingdom Farnborough
embedded world 2019
26th February 2019
Germany Nuremberg
Wearable Tech Show 2019
12th March 2019
United Kingdom London
AMPER 2019
19th March 2019
Czech Republic Brno Exhibition Centre