Hamamatsu Photonics Photo Back Illuminated 16 Channel Photodiode Array

The S11212 uses flip-chip technology that allows the PDA to receive scintillation light from the back side of the array. This flip-chip approach reduces the need for gold bond wires and junction layers on the light input side, vastly reducing the risk of wire bond damage during scintillator mounting.

The S11212 series shows a large improvement in uniformity compared to the popular conventional S5668 array that has been in production for many years. The new design also makes the new series highly reliable, by reducing the risk of bond wire damage.

The S11212 is also suitable for dual energy imaging, by combining two arrays with differing scintillator thicknesses in a vertical structure. Various configurations can be designed to match any application requirement. This new series of PDAs is set to make a large improvement to X-ray non-destructive testing applications especially baggage scanning.